Reflow Soldering Guidelines for Surface - Mount Devices

Practical Considerations For Attaching Surface-mount Components

What automated soldering methods can be considered for Mini-Circuits surface-mount components? There are two basic methods: reflow and wave soldering. Generally, reflow soldering can be done when (l) there are only surface mount components, or (2) these are present together with through-hole components and the latter will be soldered in a separate (wave soldering) step. The surface-mount compon...

Reflow Soldering Process Considerations for Surface Mount Application

SMT Line Improvements for High Mix, Low Volume Electronics Manufacturing

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Evaluation of Water Soluble and No-Clean Solder Pastes with Palladium Plated and Solder Plated SMT Devices

In response to increasing environmental concern over the use of chlorofluorocarbons (CFC's) to clean printed circuit assemblies, many surface mount operations are converting to water soluble or no-clean type solder pastes. Current trends indicate that this conversion will progress rapidly until water soluble and no-clean pastes constitute the majority of the product mix. With the introduction o...

Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow

Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during ...